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Plastic Leaded Chip Carriers(PLCC)
Plastic open cavity PLCC
packages are now available in two
popular Lead counts ---- 44 and 68.
Pre-molded Plastic Leaded Chip Carriers
are an ideal, cost-effective solution
for quick turn test and prototyping of
new IC designs. Pre-molded PLCC packages are a lower cost
alternative to more expensive ceramic leaded chip carriers. The gold plated
lead frame features J-shaped leads that tuck under the package body. Pad sizes
are available to accommodate larger die. 
These packages have JEDEC compliant
outlines and can be used with standard PLCC test sockets.
All PLCC products are offered with and
without heatspreaders.The heatspreader
versions are identical in form factor to
the standard non-heatspreader versions.
Both versions are JEDEC compliant in all
repects. The heatspreader versions give
the system designer greater latitude in
thermally enhanced board level and /or
system design.They can be easily
sealed using epoxy-coated lids or glob top.
Features:
- JEDEC standard compliant
- Available with
heatspreader option
- Fine pitch wire bond
capability
PLCC part list:
Dimensions in Inches
|
PART
NUMBER |
LEAD
COUNT |
BODY
SIZE |
DIE PAD
SIZE |
LEAD
PITCH |
| PLCC04401 |
44 |
.650 sq |
0.230 sq |
0.050 |
| PLCC04402 |
44 |
.650 sq |
0.340 sq |
0.050 |
| PLCC06801 |
68 |
.950 sq |
0.325 sq |
0.050 |
| PLCC06802 |
68 |
.950 sq |
0.410 sq |
0.050 |
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