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Burn-in Test Socket Product Line

Burn-in test sockets feature:

  • Wide range of selection including BGA, QFN/CSP, QFP, LCC, PLCC, SO, SOJ, and SSOP.
  • Wide selection of burn-in sockets for QFN leadless devices. 
  • Wide selection in the industry of sockets for BGA and CSP devices.
  • open-top surface-mount device socket and the open-top ball grid array socket
  • Short lead times with many socket configurations
Open-top BGA Sockets
Open-top BGA Sockets
QFN/CSP Sockets
QFN/CSP Sockets
uPGA(Micro PGA) Sockets
uPGA(Micro PGA) Sockets
Land Grid Array (LGA) Sockets
Land Grid Array (LGA) Sockets
PLCC Sockets
PLCC Sockets
LCC Sockets
LCC Sockets
SO Sockets
SO Sockets
QFP/TQFP Sockets
QFP/TQFP Sockets
SOJ Sockets
SOJ Sockets
SSOP Sockets
SSOP Sockets
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