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Small Outline Integrated Circuit Package (SOIC)

The SOIC includes the popular "gullwing" and "J-bend" lead shape.It has been proved with surface mount performance characteristics and has been designed to adopt easily to all SMT processes and lines.The SOIC meet the need for dense placement of chips on boards. It is  with .050" lead spacing. Ceramic SOICs typically come in 8- 28 leads. We also provide plastic version of SOIC with various Lead count.

Features:

  • Surface Mount  Package
  • Broad die pad selection
  • Comparable Foot Print  With Wide Body SOP Plastic Packaging
  • High conductivity copper leadframes
  • J-bend and Gull Wing Lead Configuration
  • Solder plate lead finish(Pb-Sn,Sn-Bi,Matte Sn available)       
SOIC part list:

Part Number Lead count Package Type Mfg Drawing No.
SOIC0801 8 SOIC G1616M-1F
SOIC1601 16 SOIC PB-F88151-JMI
SOIC1602 16 SOIC PB-F88151
SOIC2001 20 SOIC PB-F86652-C-JMI
SOIC2002 20 SOP L20Z0-9020A
SOIC2401 24 SOIC PB-F88153
SOIC2402 24 SOIC PB-F88153-JMI
SOIC2403 24 SOP L24Z0-9021A
SOIC2801 28 SOIC PB-F88154-JMI
SOIC3201 32 SOJ PB-A99A20-A