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SOP/SOIC/SSOP
We offer a large variety of Small
Outline IC packages in plastic open
cavity configurations. An ideal
quick-turn assembly solution, these
surface mount packages replicate the
footprint and performance of their
production counterparts. They feature
gold plated die pad, bond fingers, and
external leads. Additionally, the
exposed die pad can be connected to
ground, thereby reducing loop inductance
for high frequency application. The
exposed die pad should be soldered
directly to the PCB to achieve the
thermal and electrical benefits. These
packages have gull-wing formed leads and
are available in body widths of 150 and
300 mils. Some configurations are
available with E-Pads for increased heat
dissipation.
Features:
- Solder plated
exposed metal die pad
- Lower inductance
for high frequency application
- Increase
densities and shrink product size
- Highly conductive
leadframe
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SOP/SOIC/SSOP part list:
Dimensions in Inches
| PART NUMBER |
Lead count |
Package Type |
BODY WIDTH |
LEAD PITCH |
Cavity SIZE(WxL) |
| PSO00801 |
8 |
SOIC |
.150 |
.050 |
.075 x .100 |
| PSO00802 |
8 |
SOIC |
.150 |
.050 |
.085 x .120 |
| PSO01401 |
14 |
SOIC |
.150 |
.050 |
.075 x .100 |
| PSP01601 |
16 |
SSOP |
.150 |
.025 |
.075 x .100 |
| PSO01601 |
16 |
SOIC |
.150 |
.050 |
.075 x .120 |
| PSO01602 |
16 |
SOIC |
.300 |
.050 |
.150 x .220 |
| PSO02001 |
20 |
SOIC |
.300 |
.050 |
.150 x .220 |
| PSO02401 |
24 |
SOIC |
.300 |
.050 |
.150 x .220 |
| PSO02801 |
28 |
SOIC |
.300 |
.050 |
.160 x .230 |
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