|
Home >>> Products >>> Metal Packages >>> Advanced Electronic Packages
Advanced Electronic Packages
We have a series of lightweight, hermetic, high efficiency and low thermal resistance packages to satisfy the ever changing needs of the microelectronics industry.
Features:
- Offers low profile, multilayer, co-fired, co-planar feedthrus, in conjunction with a highly efficient thermal management base.
- Design for either high frequency impedance match, DC circuits or a combination of both.
- Resistance or laser weldable and compatible with existing sealing systems.
- Base materials can be designed to match substrate TCE, reducing induced thermal stress over a wide range of operating temperatures.
Application Include:
- Navigation equipment (GPS)
- Weapons Systems
- Military Satellites and Aircraft
- Radar Systems
- Test and Measurement Equipment (RF Frequency)
- Engine Controllers
- Medical Equipment
- Communications
|
Typical Material Combinations
|
|
Material
|
Base Conductivity W/m ～K
|
CTE X 10-6/～C
|
Density LBS/in 3
|
Ring Frame Material
|
| ASTM F-15 Alloy |
14 |
4.9 |
.302 |
ASTM F-15 Alloy |
| W/Cu |
175 - 205 |
6.5 - 8.3 |
.535 - .611 |
Fe Ni Alloy |
| Mo/Cu |
165 - 185 |
6.5 - 7.7 |
.357 - .361 |
Fe Ni Alloy |
| Al/SiC |
160 |
6.5 - 8.5 |
.107 - .110 |
Contact the factory |
| Al 2 O 3 |
25 |
6.9 |
.143 |
Contact the factory |
| GaAs |
44 |
6.5 |
.193 |
Contact the factory |
| AIN |
170 |
4.6 |
.120 |
Contact the factory |
Online RFQ Form
You can send an email to our sales team at sales@semipkg.com for any information or you can use the following form to place your quote or order online. Also you can print the following form and fax to us. Our sales representatives will contact you shortly.
Request For Quote (RFQ) Form
|
