| BQFP
|
Bumpered Quad Flat Pack
|
| CAV.BGA
|
Cavity Ball Grid Array |
| CBGA
|
Ceramic Ball Grid Array
|
| CDIP
|
Ceramic Dual In-line Package
|
| CERDIP
|
Ceramic Dual In-line Package. This is a hermetic package consisting of two
pieces of dry pressed ceramic surrounding a "dip formed" leadframe.
|
| CERPAK
|
Construction is similar to Cerdip, however the leads are in a "flat unformed"
configuration. This package can have leads extending from two sides of the
package (dual) or extending from four sides of the package. |
| Chip Scale Packaging
|
Also known as "chip size packaging": a high-density packaging process that
approximates the size of the chip itself and has a bigger (>50%) chip/package
area ratio. |
| COB
|
Chip On Board
|
| CPGA
|
Ceramic Pin Grid Array
|
| CQUAD
|
Ceramic Quad Package ("J") Form Leads
|
| CQFP
|
Ceramic Quad Flat Pack
|
| DCA
|
Direct Chip Attach
|
| DIP Dia D/A |
Dual In-line Package DiameterDie Attach Cavity |
| Epoxy Seal E/O |
A method of non-hermetically sealing a lid to a package with cured epoxy
material. Ends Only |
| Flip Chip
|
A semiconductor chip that is flipped (face down) and connected for package,
substrate or board. The chip typically has bumps (on the bond pads) in a
peripherial or array design. |
| Frit Seal
GR/GRDH/SL/FLD |
A method of hermetically sealing a ceramic lid to a ceramic package with
reflowed glass. GroundHeatsinkLeadframelead |
| LDCC
|
Leaded Chip Carrier (Ceramic)
|
| LLCC
|
Lead Less Chip Carrier
|
| MBGA
|
Metal Ball Grid Array developed by Olin Interconnect
|
| mBGA
|
Micro Ball Grid Array developed by Tessera Corp.
|
| MCM-PBGA
|
Multi-Chip Module-Plastic Ball Grid Array
|
| MCP Mfg |
Multi-Chip Packaging Manufacturer |
| MQFP
|
Metric Quad Flatpack
|
| MQUAD NCNEONi |
A proprietary metal QFP developed by Olin Interconnect No CommentNear Ends OnlyNickel |
| PBGA
|
Plastic Ball Grid Array
|
| PMCM
|
Plastic Multi Chip Module
|
| PQFP
|
Plastic Quad Flat Pack
|
| PDIP
|
Plastic Dual In-line Package
|
| PGA
|
Pin Grid Array
|
| PLCCProjPPGA
|
Plastic Lead Chip Carrier ProjectionPlastic Pin Grid Array |
| PWB
|
Printed Wired Board, also known as printed circuit board.
|
| QFP S/R |
Quad Flat Pack; a surface mount package with leads on all four sides. The
package body can be ceramic, metal or plastic. Sealring |
| SBGA
|
Super Ball Grid Array
|
| Sidebraze
|
This through hole package consists of a co-fired ceramic base that has leads
brazed on two parallel edges. |
| SIP
|
Single In-line Package
|
| SMT
|
Surface Mount Technology
|
| SPDIP
|
Shrink Plastic Dual In-line Package
|
| SOIC
|
Small Outline Integrated Circuit
|
| SOP
|
Small Outline Package
|
| SQFP
|
Shrink Quad Flat Pack
|
| SSOP
|
Shrink Small Outline Package
|
| Surface Mount THKTO |
A term used to describe a package whose leads or terminals are attached to the
surface of the P.C. board with solder paste. ThicknessTransistor Outline |
| TAB
|
Tape Automated Bonding; also called Tape Carrier Packaging: Uses a flexible
carrier tape, typically copper-polyimide, to connect the chip to the package,
substrate or board. |
| TBGA
|
Tape Ball Grid Array, developed by IBM. Competes with SuperBGA. Technology is
similar to TAB |
| TQFP
|
Thin Quad Flat Pack
|
| Thru-hole
|
A term used to describe a package whose leads are attached through drilled holes
in the P.C. board. |
| TSOP
|
Thin Small Outline Package
|
| TSSOP
|
Thin-Shrink Small Outline Package
|
| VQFP
|
Very (fine pitch) Quad Flat Pack
|
| VSOP
|
Very Small Outline Package
|
| Wire Bonding
|
The process of connecting the die to the leadframe substrate with very fine gold
wire. |
| Zip
|
Zip-Zag In-line package. Similar to SIP configuration, the leads are formed in a
"zig-zag" fashion. |
