Products:

• Ceramic Packages
• Side-Brazed Dual In-Line Ceramic Package(SBDIP)
• Ceramic Quad Flat Package - Cerquad
• Flat Packs(CQFP,CQFJ)/Leaded Chip Carriers(LDCC)
• No-lead Flat Pack(QFN)/Leadless Chip Carrier (LCC)
• Small Outline Integrated Circuit Package (SOIC)
• Ceramic Pin Grid Arrays (CPGA)
• Ceramic Dual-Inline Package (CDIP / CerDIP)
• Ceramic Pack Package(CerPac)
• Hybrid Package - Multi-enip Module (MCM)
• Hermetic Surface Mount Device (SMD) Packages
• Power Surface Mount Packages
• LED Package


• Metal Packages
• Transistor Outlines - TO Headers
• Advanced Electronic Packages
• Advanced Opto-electronic Packages
• Flatpack
• Plug-Ins Metal Package


• Plastic Packages
• Open Cavity QFN Package


• Lids and Covers
• Plastic Lids
• Combo Lids
• Lid With Hydrogen & Moisture Getters
• Glass Lids
• Ceramic Lids
• TO Cans


• Connectors
• Circular and Rectangular Connectors
• Headers and Feedthrus
• Specials and Customer Designs


• Burn-in & Test Sockets (Part A)
• BGA/LGA/FBGA Sockets
• QFP Sockets
• SOP Sockets
• TSOP Sockets
• PLCC Sockets
• LDCC Sockets


• Burn-in & Test Sockets (Part B)
• Axial,Radial & MELF Sockets
• BGA CSP Sockets
• Connectors
• DIP Sockets
• FlatPack Sockets
• Gull Wing Sockets
• LCC w/Castellations Sockets
• LGA Sockets
• Microwave/Hybrid Sockets
• Optical Transceiver Sockets
• PGA Sockets
• PLCC/SOJ Sockets
• QFN Sockets
• SIP Sockets
• SMD Sockets
• Socket Accessories
• TO Sockets
• ZigZag Sockets


• Burn-in & Test Sockets (Part C)
• Open-top BGA Sockets
• QFN/CSP Sockets
• uPGA(Micro PGA) Sockets
• Land Grid Array (LGA) Sockets
• PLCC Sockets
• LCC Sockets
• SO Sockets
• QFP/TQFP Sockets
• SOJ Sockets
• SSOP Sockets
• BGA Sockets
• mBGA Sockets


• Burn-in & Test Sockets (Part D)
• BGA Sockets
• QFN Sockets

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